INSPEKTIONSLÖSUNGEN: YSi-SP

Features:

  • „1-head solution“ to perform various inspections with a single head
  • Achieves high-accuracy high-speed inspections using 3D+2D inspection, image resolution switch-over and more
  • A thorough and extensive machine-to-machine (M2M) solution
  • Statistical Process Control (SPC) for diverse statistical processing
  • Optional features to enable handling various products

Yamaha Printer YCP10

Specifications:

Model YSi-SP
Applicable PCB L 510 x W 460 mm to L 50 x W 50 mm (single lane spec)
*No dual lane specification available.
Horizontal resolution (FOV size) 1)25 µm / 12.5 µm (approx. 50 x 50 mm)
2)20 µm / 10 µm (approx. 40 x 40 mm)
3)15 µm / 7.5 µm (approx. 30 x 30 mm)
*All are standard selection type.
Height resolution 1 µm
  • Inspection items
Solder paste printing quality (volume, height, area and misalignment)
  • Power supply
Single-phase AC 200 V–230 V ±10 %
  • Air supply source
Airless specification
  • External dimension
L 904 x W 1,080 x H 1,478 mm
  • Weight
Approx. 550 kg

Diese Informationen können wir Ihnen derzeit nur in englischer Sprache zur Verfügung stellen.