HYBRIDER BESTÜCKUNGSAUTOMAT: YSH20

Features:

  • 4,500 UPH (0.8 sec/unit); the top mounting capability in flipchip bonders
  • +/- 10 µm (3σ) mounting accuracy
  • YWF wafer supply unit “6/8/12 inch”, “expand ring”, and “θ angle correction” applicable
  • 0.6 × 0.6 mm to 18 × 18 mm components applicable

Yamaha Printer YCP10

Specifications:

Model YSH20
Applicable PCB L 50 x W 30 mm to L 250 x W 200 mm
** „Up to L 340 x W 340 mm“ is applicable. Please contact us separately.
  • Mounting accuracy (when using Yamaha’s standard components)
[2F2F heads & multi-camera type]
Repeatability (3): +/- 0.010 mm/unit +/- 0.05 degree
[4M4M heads & multi-camera type] ** under development
Repeatability (3): +/- 0.010 mm/unit +/- 0.05 degree
  • Mounting capability (under optimum condition)
[2F2F heads & multi-camera type] 4,500 UPH (0.8 sec/unit) ** excluding dipping 3,600 UPH (1.0 sec/unit) ** including dipping
[4M4M heads & multi-camera type] ** under development 5,500 UPH (0.65 sec/unit) ** excluding dipping 4,500 UPH (0.8 sec/unit) ** including dipping
Component supply configuration Wafer (6/8/12 inch flat ring), waffle tray, tape reel (8/12/16 mm width)
Applicable components [multi-camera] flipchip: 0.6 x 0.6 mm to 18 x 18 mm bump diameter 60 μm or more bump pitch 110 μm or more, H 0.7 mm or less
SMD Chip: 0402 (metric base) to 20 x 20 mm, H 6mm or less
Power supply 3-phase AC 200/208/220/240/380/400/416V +/- 10% 50/60Hz
Air supply source 0.5 MPa or more, in clean, dry state
External dimension
** excluding projections
L 1,400 x W 1,820 x H 1,515 mm (main unit only)
L 1,400 x W 2,035 x H 1,515 mm (when YWF wafer supply unit is installed)
Weight Approx. 2,470 kg (main unit only)
Approx. 2,780 kg (when YWF wafer supply unit is installed)
* Specifications and appearance are subject to change without prior notice.

Diese Informationen können wir Ihnen derzeit nur in englischer Sprache zur Verfügung stellen.