FLIP CHIP BONDER: YSB55w

Features:

  • High bonding accuracy and x3 productivity of conventional machines!
    This brings a New Era in Semiconductor packaging for the expanding flip chip market.
  • High-Speed 8-die simultaneous pickup & simultaneous transfer achieve 13,000 UPH
  • High-Accuracy ±5μm (3σ)
  • High-Quality & Flexibility

Yamaha Printer YCP10

Specifications:

Model YSB55w
  • Applicable substrate
L 240 x W 200 to L 50 x W 50 mm
  • Substrate thickness
0.2 to 3.0 mm
  • Transport direction
Left to Right (option : Right to Left)
  • Bonding accuracy
±5 µm (3σ) (When using Yamaha’s standard components)
  • Throughput
13,000 UPH (Including processing time)
  • Applicable wafer size
12 inch wafer
  • Applicable die size
□2 to 30 mm
  • Power supply
3-Phase AC 200/208/220/240/380/400/416 V ± 10 % 50/60 Hz
  • Air supply
0.45 MPa or more
  • External dimension
L 2,090 x D 1,866 x H 1,550 mm (YSB55w main unit & wafer feed unit)
  • Weight
Approx. 3,600 kg (YSB55w main unit & wafer feed unit)
* Specification and appearance are subject to change without prior notice.